Semiconductor storage device

ABSTRACT

A semiconductor storage device includes a first semiconductor substrate, a second semiconductor substrate, a first memory cell and a second memory cell provided between the first semiconductor substrate and the second semiconductor substrate, a first word line electrically connected to the first memory cell, a second word line electrically connected to the second memory cell, a first transistor that is provided on the first semiconductor substrate and electrically connected between the first word line and a first wiring through which a voltage is applied to the first word line, and a second transistor that is provided on the semiconductor substrate and electrically connected between the second word line and a second wiring through which a voltage is applied to the second word line.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2021-015362, filed Feb. 2, 2021, theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a semiconductor storagedevice.

BACKGROUND

A semiconductor storage device of the related art includes a firstsemiconductor substrate, a second semiconductor substrate, a firstmemory cell and a second memory cell provided between the firstsemiconductor substrate and the second semiconductor substrate, a firstword line connected to the first memory cell, a second word lineconnected to the second memory cell, a first transistor electricallyconnected to the first word line, and a second transistor electricallyconnected to the second word line.

DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic block diagram illustrating a configuration of amemory system according to a first embodiment.

FIG. 2 is a side view schematically illustrating an example of theconfiguration of the memory system.

FIG. 3 is a plan view schematically illustrating the example of theconfiguration of the memory system.

FIG. 4 is a schematic block diagram illustrating an example of aconfiguration of a memory die.

FIG. 5 is a schematic circuit diagram illustrating a circuitconfiguration of a portion of the memory die.

FIG. 6 is a schematic circuit diagram illustrating a circuitconfiguration of another portion of the memory die.

FIG. 7 is an exploded perspective view schematically illustrating twochips of the memory die.

FIG. 8 is an exploded perspective view schematically illustratingtransistors and wiring layers in the example of the configuration of thememory die.

FIG. 9 is a cross-sectional view schematically illustrating a first chipof the memory die.

FIG. 10 is an enlarged view schematically illustrating a portion of thefirst chip indicated by A in FIG. 9.

FIG. 11 is a bottom view schematically illustrating the first chip.

FIG. 12 is an enlarged view schematically illustrating a portion of thefirst chip indicated by B in FIG. 11.

FIG. 13 is an enlarged view schematically illustrating a portion of thefirst chip indicated by C in FIG. 11.

FIG. 14 is an enlarged view schematically illustrating a portion of thefirst chip indicated by D in FIG. 13.

FIG. 15 is an enlarged view schematically illustrating a portion of thefirst chip indicated by E in FIG. 14.

FIG. 16 is a cross-sectional view schematically illustrating a secondchip of the memory die.

FIG. 17 is a cross-sectional view schematically illustrating theconfiguration of the memory die including the first and second chips.

FIG. 18 is a bottom view schematically illustrating a configuration ofmemory cell array layers in the first chip.

FIG. 19 is a bottom view schematically illustrating a configuration of atransistor layer in the first chip.

FIG. 20 is a plan view schematically illustrating a configuration of thesecond chip.

FIG. 21 is a bottom view schematically illustrating the transistor layerin the first chip.

FIG. 22 is a plan view schematically illustrating a partialconfiguration of the second chip.

FIG. 23 is a cross-sectional view schematically illustrating asemiconductor storage device according to a second embodiment.

FIG. 24 is a cross-sectional view schematically illustrating asemiconductor storage device according to a third embodiment.

FIG. 25 is a cross-sectional view schematically illustrating asemiconductor storage device according to a fourth embodiment.

FIG. 26 is a cross-sectional view schematically illustrating asemiconductor storage device according to another embodiment.

FIG. 27 is a cross-sectional view schematically illustrating asemiconductor storage device according to still another embodiment.

DETAILED DESCRIPTION

Embodiments provide a semiconductor storage device that facilitates highdensity integration.

In general, according to one embodiment, a semiconductor storage deviceincludes a first semiconductor substrate, a second semiconductorsubstrate, a first memory cell and a second memory cell provided betweenthe first semiconductor substrate and the second semiconductorsubstrate, a first word line electrically connected to the first memorycell, a second word line electrically connected to the second memorycell, a first transistor that is provided on the first semiconductorsubstrate and electrically connected between the first word line and afirst wiring through which a voltage is applied to the first word line,and a second transistor that is provided on the second semiconductorsubstrate and electrically connected between the second word line and asecond wiring through which a voltage is applied to the second wordline.

Then, a semiconductor storage device according to embodiments will bedescribed in detail with reference to the drawings. The followingembodiments are merely examples, and are not intended to limit thepresent disclosure. The following drawings are schematic, and someconfigurations and the like may be omitted for the sake of conveniencein description. Common portions in a plurality of embodiments aredenoted by the same reference signs, and repetitive description thereofmay be omitted.

The term “semiconductor storage device” used in the presentspecification may mean a memory die, or a memory system including acontroller die, such as a memory chip, a memory card, or a solid statedrive (SSD). The term “semiconductor storage device” may mean aconfiguration that includes a host computer such as a smartphone, atablet terminal, and a personal computer.

In the present specification, when a first component is said to be“electrically connected” to a second component, the first component maybe directly connected to the second component, or the first componentmaybe connected to the second component via a wiring, a semiconductormember, a transistor, or the like. For example, when three transistorsare connected in series, the first transistor is “electricallyconnected” to the third transistor even though the second transistor isin an OFF state.

In the present specification, a case where the first component is saidto be “connected between” the second component and the third componentmay mean that the first component, the second component, and the thirdcomponent are connected in series and the second component is connectedto the third component via the first component.

In the present specification, a case where a circuit or the like is saidto “cause two wirings and the like to be electrically connected” maymean, for example, that the circuit or the like includes a transistorand the like, the transistor and the like are provided on a current pathbetween the two wirings and the like, and the transistor and the liketransition into an ON state.

In the present specification, a predetermined direction parallel to anupper surface of a semiconductor substrate is referred to as an Xdirection, a direction which is parallel to the upper surface of thesemiconductor substrate and is perpendicular to the X direction isreferred to as a Y direction, and a direction perpendicular to the uppersurface of the semiconductor substrate is referred to as a Z direction.

In the present specification, a direction along a predetermined surfaceis referred to as a first direction, a direction intersecting the firstdirection along the predetermined surface is referred to as a seconddirection, and a direction intersecting the predetermined surface isreferred to as a third direction. The first direction, the seconddirection, and the third direction may or may not correspond to any ofthe X direction, the Y direction, and the Z direction.

When expressions such as “upper” and “lower” are used in the presentspecification, for example, among two semiconductor substrates includedin a memory die, one provided with a bonding pad electrode may bedefined as the upper semiconductor substrate, and the other not providedwith the bonding pad electrode may be defined as the lower semiconductorsubstrate. When components included in the memory die are described, forexample, a direction towards the upper semiconductor substrate along theZ direction may be referred to as being upward, and a direction towardsthe lower semiconductor substrate along the Z direction may be referredto as being downward. A case where a lower surface and a lower end of acertain component are described may mean a surface and an end portion ofthe component on the lower semiconductor substrate side. A case where anupper surface and an upper end of a certain component are described maymean a surface and an end portion of the component on the uppersemiconductor substrate side. A surface intersecting the X direction orthe Y direction may be referred to as a side surface or the like.

First Embodiment Memory System 10

FIG. 1 is a schematic block diagram illustrating a configuration of amemory system 10 according to a first embodiment.

The memory system 10, for example, reads, writes, and erases user datain accordance with a signal transmitted from a host computer 20. Thememory system 10 is, for example, a memory chip, a memory card, an SSD,or other systems capable of storing user data. The memory system 10includes a plurality of memory dies MD and a controller die CD. Thememory die MD stores user data. The controller die CD is connected tothe plurality of memory dies MD and the host computer 20. The controllerdie CD includes a processor, and a RAM, for example. The controller dieCD performs processing such as conversion between a logical address anda physical address, bit error detection/correction, garbage collection(compaction), and wear leveling.

FIG. 2 is a side view schematically illustrating an example of theconfiguration of the memory system 10 according to the first embodiment.FIG. 3 is a plan view schematically illustrating the example of theconfiguration. For convenience of description, illustrations of somecomponents are omitted in FIGS. 2 and 3.

As illustrated in FIG. 2, the memory system 10 according to the presentembodiment includes a mounting substrate MSB, a plurality of memory diesMD, and a controller die CD. A bonding pad electrode P_(X) is providedin a region of an end portion of the upper surface of the mountingsubstrate MSB in the Y direction. A region of the upper surface of themounting substrate MSB other than the end portion in the Y direction isadhered to the lower surface of the memory die MD via an adhesive or thelike. A plurality of memory dies MD is stacked on the mounting substrateMSB. A bonding pad electrode P_(X) is provided in the region of the endportion in the Y direction of the upper surface of the memory die MD. Aregion of the upper surface of the memory die MD other than the endportion in the Y direction is adhered to the lower surface of anothermemory die MD or the lower surface of the controller die CD via anadhesive or the like. The controller die CD is stacked on the memory dieMD. A bonding pad electrode P_(X) is provided in a region of an endportion of the upper surface of the controller die CD in the Ydirection.

As illustrated in FIG. 3, each of the mounting substrate MSB, theplurality of memory dies MD, and the controller die CD includes aplurality of bonding pad electrodes P_(X) arranged in the X direction.The plurality of bonding pad electrodes P_(X) provided on the mountingsubstrate MSB, the plurality of memory dies MD, and the controller dieCD are connected to each other via bonding wires B.

The components illustrated in FIGS. 2 and 3 are merely an example, andthe specific components may be adjusted as appropriate. For example, inthe example illustrated in FIGS. 2 and 3, the controller die CD isstacked on the plurality of memory die MD. The memory die MD and thecontroller die CD are connected by a bonding wire B. The plurality ofmemory dies MD and the controller die CDs are included in one package.However, the controller die CD may be included in a package differentfrom the memory die MD.

Circuit Configuration of Memory Die MD

FIG. 4 is a schematic block diagram illustrating an example of theconfiguration of the memory die MD according to a first embodiment.FIGS. 5 and 6 are schematic circuit diagrams illustrating a partialconfiguration of the memory die MD.

FIG. 4 illustrates a plurality of control terminals and the like. Theplurality of control terminals may be represented as control terminalscorresponding to a high active signal (positive logic signal). Theplurality of control terminals may be represented as control terminalscorresponding to a low active signal (negative logic signal). Theplurality of control terminals may be represented as control terminalscorresponding to both the high active signal and the low active signal.In FIG. 4, the reference sign of the control terminal corresponding tothe low active signal includes an overline. In the presentspecification, the reference sign of the control terminal correspondingto the low active signal includes a slash (“/”). The illustration ofFIG. 4 is an example, and the specific form may be adjusted asappropriate. For example, some or all of high active signals may be setto low active signals, or some or all of low active signals may be setto high active signals.

As illustrated in FIG. 4, the memory die MD includes a memory cell arrayMCA and a peripheral circuit PC. The peripheral circuit PC includes avoltage generation circuit VG, a row decoder RD, a sense amplifiermodule SAM, and a sequencer SQC. The peripheral circuit PC furtherincludes a cache memory CM, an address register ADR, a command registerCMR, and a status register STR. The peripheral circuit PC furtherincludes an input/output control circuit I/O and a logic circuit CTR.

Circuit Configuration of Memory Cell Array MCA

As illustrated in FIG. 5, the memory cell array MCA includes a pluralityof memory blocks BLK. Each of the plurality of memory blocks BLKincludes a plurality of string units SU. Each of the plurality of stringunits SU includes a plurality of memory strings MS. One end of each ofthe plurality of memory strings MS is connected to the peripheralcircuit PC via a bit line BL. The other end of each of the plurality ofmemory strings MS is connected to the peripheral circuit PC via a commonsource line SL.

The memory string MS includes a drain-side select transistor STD, aplurality of memory cells (memory transistors) MC, a source-side selecttransistor STS, and a source-side select transistor STSb. The drain-sideselect transistor STD, the plurality of memory cells MC, the source-sideselect transistor STS, and the source-side select transistor STSb areconnected in series between the bit line BL and the source line SL. Thedrain-side select transistor STD, the source-side select transistor STS,and the source-side select transistor STSb may be simply referred belowto as select transistors (STD, STS, and STSb).

The memory cell MC is a field effect transistor. The memory cell MCincludes a semiconductor layer, a gate insulating film, and a gateelectrode. The semiconductor layer functions as a channel region. Thegate insulating film includes a charge storage film. The thresholdvoltage of the memory cell MC changes depending on the charge quantityin the charge storage film. The memory cell MC stores data of one bit ora plurality of bits. A word line WL is connected to each of the gateelectrodes of the plurality of memory cells MC corresponding to onememory string MS. Each word line WL is commonly connected across allmemory strings MS in one memory block BLK.

The select transistors (STD, STS, and STSb) are field effecttransistors. Each of the select transistors (STD, STS, and STSb)includes a semiconductor layer, a gate insulating film, and a gateelectrode. The semiconductor layer functions as a channel region.Selection gate lines (SGD, SGS, and SGSb) are connected to gateelectrodes of the select transistors (STD, STS, and STSb), respectively.One drain-side selection gate line SGD is commonly connected across allmemory strings MS in one string unit SU. One source-side selection gateline SGS is commonly connected across all memory strings MS in onememory block BLK. One source-side selection gate line SGSb is commonlyconnected across all memory strings MS in one memory block BLK.

Circuit Configuration of Voltage Generation Circuit VG

The voltage generation circuit VG (FIG. 4) includes, for example, astep-down circuit and a step-up circuit. The step-down circuit is, forexample, a regulator. The step-up circuit is, for example, a charge pumpcircuit. Each of the step-down circuit and the step-up circuit isconnected to a power-source voltage supply line. A power-source voltageV_(CC) and a ground voltage V_(SS) are supplied to the power-sourcevoltage supply line. The power-source voltage supply line is connectedto, for example, the bonding pad electrode P_(X) described withreference to FIGS. 2 and 3. The voltage generation circuit VG generatesa plurality of operation voltages and simultaneously outputs thegenerated operation voltages to a plurality of voltage supply lines,respectively. The plurality of operation voltages are supplied to thebit line BL, the source line SL, the word line WL, and the selectiongate lines (SGD, SGS, and SGSb), for example, during a read operation, awrite operation, and an erasing operation on the memory cell array MCA.The operation voltage is appropriately adjusted in accordance with acontrol signal from the sequencer SQC.

Circuit Configuration of Row Decoder RD

The row decoder RD includes a block decoder BLKD, for example, asillustrated in FIG. 6.

The block decoder BLKD includes a plurality of block decoding unitsblkd. The plurality of block decoding units blkd are providedrespectively for the plurality of memory blocks BLK in the memory cellarray MCA. The block decoding unit blkd includes a plurality oftransistors T_(BLK). The plurality of transistors T_(BLK) are providedrespectively for the plurality of word lines WL in the memory block BLK.The transistor T_(BLK) is, for example, a field effect type NMOStransistor. The drain electrode of the transistor T_(BLK) is connectedto the word line WL. The source electrode of the transistor T_(BLK) isconnected to a wiring CG. The wiring CG is connected to a plurality ofblock decoding units blkd in the block decoder BLKD. For example, eachwiring CG may be connected to the source electrode of one transistorT_(BLK) in all the block decoding units blkd in the block decoder BLKD.The gate electrode of the transistor T_(BLK) is connected to a signalsupply line BLKSEL. A plurality of signal supply lines BLKSEL areprovided respectively for the block decoding units blkd. The signalsupply line BLKSEL is connected to all the transistors T_(BLK) in theblock decoding unit blkd.

In a read operation, a write operation, and the like, for example, onesignal supply line BLKSEL corresponding to a row address RA included inaddress data D_(ADD) stored in the address register ADR (FIG. 4) is inan “H” state, and other signal supply lines BLKSEL are in an “L” state.For example, a predetermined drive voltage having a positive magnitudeis supplied to the one signal supply line BLKSEL, and a ground voltageV_(SS) or the like is supplied to other signal supply lines BLKSEL.Thus, all the word lines WL in one memory block BLK corresponding to therow address RA are electrically connected respectively to all thewirings CG. In addition, all the word lines WL in the other memoryblocks BLK are in a floating state.

The row decoder RD further includes a decoding circuit (not illustrated)and a switch circuit (not illustrated).

For example, the decoding circuit (not illustrated) sequentially decodesthe row address RA in accordance with the control signal from thesequencer SQC (FIG. 4), selectively sets one of the plurality of signalsupply lines BLKSEL to be in the “H” state, and sets others to be in the“L” state. The switch circuit supplies a plurality of voltages outputfrom the voltage generation circuit VG to the desired wiring CG inaccordance with output signals of the decoding circuit and the sequencerSQC.

Circuit Configuration of Sense Amplifier Module SAM

The sense amplifier module SAM (FIG. 4) includes, for example, aplurality of sense amplifiers. The sense amplifier includes a sensetransistor, a data wiring, a latch circuit, and a voltage transfercircuit. The gate electrode of the sense transistor is connected to thebit line BL. The drain electrode of the sense transistor is connected tothe data wiring. The sense transistor transitions into the ON state inaccordance with the voltage or the current of the bit line BL. The datawiring is charged or discharged in accordance with the ON/OFF state ofthe sense transistor. The latch circuit latches data of “1” or “0” inaccordance with the voltage of the data wiring. The voltage transfercircuit causes the bit line BL to be electrically connected to one ofthe two voltage supply lines in accordance with the data latched by thelatch circuit.

Circuit Configuration of Cache Memory CM

The cache memory CM (FIG. 4) includes a plurality of latch circuits. Theplurality of latch circuits are connected to the latch circuit in thesense amplifier module SAM via a wiring DBUS. Pieces of data DATincluded in the plurality of latch circuits are sequentially transferredto the sense amplifier module SAM or the input/output control circuitI/O.

A decoding circuit (not illustrated) and a switch circuit (notillustrated) are connected to the cache memory CM. The decoding circuitdecodes a column address CA included in the address data D_(ADD) storedin the address register ADR (FIG. 4). The switch circuit causes thelatch circuit corresponding to the column address CA to be electricallyconnected to a bus DB in accordance with the output signal of thedecoding circuit.

Circuit Configuration of Sequencer SQC

The sequencer SQC (FIG. 4) outputs an internal control signal to the rowdecoder RD, the sense amplifier module SAM, and the voltage generationcircuit VG in accordance with command data D_(CMD) stored in the commandregister CMR. The sequencer SQC outputs status data D_(ST) indicatingthe state of the sequencer itself to the status register STR asappropriate.

The sequencer SQC generates a ready/busy signal and outputs thegenerated ready/busy signal to a terminal RY//BY. During a period (busyperiod) in which the terminal RY//BY is in the “L” state, an access tothe memory die MD is basically prohibited. During a period (readyperiod) in which the terminal RY//BY is in the “H” state, the access tothe memory die MD is permitted. The terminal RY//BY is implemented, forexample, by the bonding pad electrode P_(X) described with reference toFIGS. 2 and 3.

Circuit Configuration of Input/output Control Circuit I/O

The input/output control circuit I/O includes data signal input/outputterminals DQ0 to DQ7, toggle signal input/output terminals DQS/DQS, aplurality of input circuits, a plurality of output circuits, a shiftregister, and a buffer circuit. The plurality of input circuits, theplurality of output circuits, the shift register, and the buffer circuitare connected to terminals to which the power-source voltage V_(CCQ) andthe ground voltage V_(SS) are supplied, respectively.

The data signal input/output terminals DQ0 to DQ7, the toggle signalinput/output terminals DQS/DQS, and the terminals to which thepower-source voltage V_(CCQ) are supplied are implemented, for example,by the bonding pad electrodes P_(X) described with reference to FIGS. 2and 3. Data input via the data signal input/output terminals DQ0 to DQ7is output from the buffer circuit to the cache memory CM, the addressregister ADR, or the command register CMR in accordance with theinternal control signal from the logic circuit CTR. Data output via thedata signal input/output terminals DQ0 to DQ7 is input to the buffercircuit from the cache memory CM or the status register STR inaccordance with the internal control signal from the logic circuit CTR.

Circuit Configuration of Logic Circuit CTR

The logic circuit CTR receives an external control signal from thecontroller die CD via external control terminals /CEn, CLE, ALE, /WE,RE, and /RE, and outputs the internal control signal to the input/outputcontrol circuit I/O in response to the reception. The external controlterminals /CEn, CLE, ALE, /WE, RE, and /RE are implemented, for example,by the bonding pad electrodes P_(X) described with reference to FIGS. 2and 3.

Structure of Memory Die MD

FIGS. 7 and 8 are exploded perspective views schematically illustratingthe example of the configuration of the memory die MD. In FIG. 8,illustrations of the configuration of the transistor and the like areomitted in a partial region of the upper surface of a semiconductorsubstrate 150. In this region, the configuration of the transistor andthe like may be arranged in a complicated pattern.

As illustrated in FIG. 7, the memory die MD includes a chip C_(M) and achip C_(P). The plurality of bonding pad electrodes P_(X) are providedon the upper surface of the chip C_(M). As illustrated in FIG. 8, thechip C_(M) includes a semiconductor substrate 100, a plurality oftransistors Tr provided on the lower surface of the semiconductorsubstrate 100, the memory cell array MCA provided below the transistorsTr, and a plurality of first bonding electrodes P_(I1) provided on thelower surface of the chip C_(M). The chip C_(P) includes thesemiconductor substrate 150, a plurality of transistors Tr provided onthe upper surface of the semiconductor substrate 150, and a plurality ofsecond bonding electrodes P_(I2) provided on the upper surface of thechip C_(P). The memory cell array MCA and the plurality of transistorsTr in the chip C_(M) are electrically connected to the plurality oftransistors Tr in the chip C_(P) via the plurality of first bondingelectrodes P_(I1) and the plurality of second bonding electrodes P_(I2).The plurality of transistors Tr provided in the chip C_(M) and the chipC_(P) function as a portion of the peripheral circuit PC (FIG. 4).

In the chips C_(M) and C_(P), a surface on which the plurality of firstbonding electrodes P_(I1) or the plurality of second bonding electrodesP_(I2) are provided is referred below to as a front surface, and asurface opposite to the front surface is referred below to as a rearsurface.

The chip C_(M)and the chip C_(P) are disposed so that the front surfaceof the chip C_(M) faces the front surface of the chip C_(P). Theplurality of first bonding electrodes P_(I1) are provided respectivelycorresponding to the plurality of second bonding electrodes P_(I2), andare arranged at locations bondable to the plurality of second bondingelectrodes P_(I2). The first bonding electrodes P_(I1) and the secondbonding electrodes P_(I2) function as bonding electrodes for bonding thechip C_(M) and the chip C_(P) to each other and causing the chip C_(M)and the chip C_(P) to be electrically connected to each other.

In the example of FIG. 7, corners a1, a2, a3, and a4 of the chip C_(M)correspond to corners b1, b2, b3, and b4 of the chip C_(P),respectively.

Structure of Chip C_(M)

FIG. 9 is a cross-sectional view schematically illustrating the chipC_(M). FIG. 10 is an enlarged view schematically illustrating a portionof the chip C_(M) indicated by A in FIG. 9. FIG. 11 is a bottom viewschematically illustrating the chip C_(M). FIG. 12 is an enlarged viewschematically illustrating a portion of the chip C_(M) indicated by B inFIG. 11. FIG. 13 is an enlarged view schematically illustrating aportion of the chip C_(M) indicated by C in FIG. 11. FIG. 14 is anenlarged view schematically illustrating a portion of the chip C_(M)indicated by D in FIG. 13. FIG. 15 is an enlarged view schematicallyillustrating a portion of the chip C_(M) indicated by E in FIG. 14. InFIG. 12, illustration of a partial region (first hookup region R_(HU1)described later) is omitted.

For example, as illustrated in FIG. 9, the chip C_(M) includes atransistor layer L_(TR) provided on the lower surface of thesemiconductor substrate 100, a wiring layer D0 provided below thetransistor layer L_(TR), a wiring layer D1 provided below the wiringlayer D0, and a wiring layer D2 provided below the wiring layer D1. Thechip C_(M) includes a memory cell array layer L_(MCA1) provided belowthe wiring layer D2, a memory cell array layer L_(MCA2) provided belowthe memory cell array layer L_(MCA1), and a wiring layer M0 providedbelow the memory cell array layer L_(MCA2). As illustrated in FIG. 8,the chip C_(M) further includes a wiring layer M1 provided below thewiring layer M0, a wiring layer M2 provided below the wiring layer M1,and a wiring layer M3 provided below the wiring layer M2.

For example, as illustrated in FIG. 11, the semiconductor substrate 100is provided with four memory cell array regions R_(MCA) arranged in theX direction and the Y direction. The memory cell array region R_(MCA)includes two memory hole regions R_(MH) arranged in the X direction.Further, two first hookup regions R_(HU1) arranged in the X directionand a second hookup region R_(HU2) provided between the two first hookupregions are provided between the two memory hole regions R_(MH). Aperipheral region RP is provided at the end portion of the semiconductorsubstrate 100 in the Y direction.

In the following description, when the “memory cell array regionR_(MCA)”, the “memory hole region R_(MH)”, the “first hookup regionR_(HU1)”, the “second hookup region R_(HU2)”, or the “peripheral regionRP” is described, it is assumed that the described region includes notonly the region in the memory cell array layers L_(MCA1) and L_(MCA2)but also the corresponding region in other layers (semiconductorsubstrate 100, transistor layer L_(TR), and wiring layers D0, D1, D2,M0, M1, and M2) included in the chip C_(M) and the corresponding regionin the layers included in the chip C_(F).

Structure of Semiconductor Substrate 100

The semiconductor substrate 100 is, for example, a semiconductorsubstrate configured with P-type silicon (Si) containing P-typeimpurities such as boron (B) . For example, as illustrated in FIG. 9, anactive region 100A and an insulating region 100I made of silicon oxide(SiO₂) or the like are provided on the front surface of thesemiconductor substrate 100. The active region 100A may be an N-typewell region containing N-type impurities such as phosphorus (P), aP-type well region containing P-type impurities such as boron (B), or asemiconductor substrate region in which the N-type well region and theP-type well region are not provided.

Structure of Transistor Layer L_(TR)

For example, as illustrated in FIG. 9, a wiring layer GC is provided onthe lower surface of the semiconductor substrate 100 via an insulatinglayer (not illustrated). The wiring layer GC includes a plurality ofelectrodes gc facing the front surface of the semiconductor substrate100. Each region of the semiconductor substrate 100 and the plurality ofelectrodes gc included in the wiring layer GC are connected to contactsCS, respectively.

The active regions 100A of the semiconductor substrate 100 function aschannel regions of a plurality of transistors Tr constituting theperipheral circuit PC, one electrodes of a plurality of capacitors Cap,and the like, respectively.

The plurality of electrodes gc included in the wiring layer GC functionsas gate electrodes of the plurality of transistors Tr constituting theperipheral circuit PC, the other electrodes of the plurality ofcapacitors Cap, and the like, respectively.

The contact CS extends in the Z direction and is connected to the lowersurface of the semiconductor substrate 100 or the lower surface of theelectrode gc at the upper end of the contact CS. An impurity regioncontaining N-type impurities or P-type impurities is provided at aportion at which the contact CS and the semiconductor substrate 100 areconnected to each other. The contact CS may include, for example, alaminated film of a barrier conductive film made of titanium nitride(TiN) or the like and a metal film made of tungsten (W) or the like.

Structure of Wiring Layers D0, D1, and D2

For example, as illustrated in FIG. 9, a plurality of wirings includedin the wiring layers D0, D1, and D2 are electrically connected to atleast one of the components of the memory cell array layer L_(MCA), thecomponents of the transistor layer L_(TR), and the semiconductorsubstrate 100.

The wiring layers D0, D1, and D2 include a plurality of wirings d0, d1,and d2, respectively. The plurality of wirings d0, d1, and d2 mayinclude, for example, a laminated film of a barrier conductive film madeof titanium nitride (TiN), tantalum nitride (TaN) or the like and ametal film made of tungsten (W), copper (Cu), aluminum (Al), or thelike.

Structure of Memory Cell Array Layers L_(MCA1) and L_(MCA2) in MemoryHole Region R_(MH)

For example, as illustrated in FIG. 12, a plurality of memory blocks BLK(in the example in FIG. 12, memory blocks BLK_(A) to BLK_(H)) arrangedin the Y direction are provided in the memory cell array layers L_(MCA1)and L_(MCA2).

In the following description, the first memory block BLK, the 4nB-th (nBis a positive integer of 1 or more) memory block BLK, the (4nB+1)thmemory block BLK, and the (4nB+4)th memory block BLK counting from oneside (for example, negative side in the Y direction in FIG. 12) in the Ydirection may be referred to as memory blocks BLKa. In FIG. 12, memoryblocks BLK_(A), BLK_(D), BLK_(E), and BLK_(H) are exemplified as thememory block BLKa. In the following description, the second memory blockBLK, the third memory block BLK, the (4nB+2)th memory block BLK, and the(4nB+3)th memory block BLK counting from the one side (for example,negative side in the Y direction in FIG. 12) in the Y direction may bereferred to as memory blocks BLKf. In FIG. 12, memory blocks BLK_(B),BLK_(C), BLK_(F), and BLK_(G) are exemplified as the memory block BLKf.

For example, as illustrated in FIG. 14, the memory block BLK includes aplurality of string unit SU arranged in the Y direction. An inter-blockinsulating layer ST made of silicon oxide (SiO₂) or the like is providedbetween two memory blocks BLK adjacent to each other in the Y direction.For example, as illustrated in FIG. 15, an inter-string unit insulatinglayer SHE made of silicon oxide (SiO₂) or the like is provided betweentwo string units SU adjacent to each other in the Y direction.

For example, as illustrated in FIG. 9, the memory block BLK includes aplurality of conductive layers 110 arranged in the Z direction and aplurality of semiconductor pillars 120 extending in the Z direction. Forexample, as illustrated in FIG. 10, the memory block BLK includes aplurality of gate insulating films 130 provided between the plurality ofconductive layers 110 and the plurality of semiconductor pillars 120,respectively.

The conductive layer 110 is a substantially plate-shaped conductivelayer extending in the X direction. The conductive layer 110 includes aplurality of through-holes provided corresponding to the semiconductorpillars 120 (FIG. 9). The inner peripheral surfaces of the plurality ofthrough-holes face the outer peripheral surfaces of the semiconductorpillars 120 via the gate insulating films 130, respectively. Theconductive layer 110 may include a laminated film of a barrierconductive film made of titanium nitride (TiN) or the like and a metalfilm made of tungsten (W) or the like. The conductive layer 110 maycontain, for example, polycrystalline silicon containing impurities suchas phosphorus (P) or boron (B). Insulating layers 101 (FIG. 10) made ofsilicon oxide (SiO₂) or the like are provided between the plurality ofconductive layers 110 arranged in the Z direction.

As illustrated in FIG. 9, a conductive layer 111 is provided above theconductive layer 110. The conductive layer 111 may contain, for example,polycrystalline silicon containing impurities such as phosphorus (P) orboron (B). An insulating layer made of silicon oxide (SiO₂) or the likeis provided between the conductive layer 111 and the conductive layer110.

A conductive layer 112 is provided above the conductive layer 111. Theconductive layer 112 may contain, for example, polycrystalline siliconcontaining impurities such as phosphorus (P) or boron (B). Theconductive layer 112 may contain, for example, metal such as tungsten(W) or may include a conductive layer made of tungsten silicide or thelike or another conductive layer. An insulating layer made of siliconoxide (SiO₂) or the like is provided between the conductive layer 112and the conductive layer 111.

The conductive layer 112 functions as the source line SL (FIG. 5). Thesource line SL is provided in common for all the memory blocks BLKincluded in the memory cell array region R_(MCA) (FIG. 11) , forexample.

The conductive layer 111 functions as the source-side selection gateline SGSb (FIG. 5) and the gate electrodes of the plurality ofsource-side select transistors STSb connected to the source-sideselection gate line SGSb. The conductive layer 111 is electricallyindependent for each memory block BLK.

Among the plurality of conductive layers 110, one or a plurality ofconductive layers 110 located on the uppermost layer function as thesource-side selection gate line SGS (FIG. 5) and the gate electrodes ofthe plurality of source-side select transistors STS connected to thesource-side selection gate line SGS. The plurality of conductive layers110 are electrically independent for each memory block BLK.

A plurality of conductive layers 110 located below the above-describedconductive layers 110 function as the word lines WLs (FIG. 5) and thegate electrodes of the plurality of memory cells MC (FIG. 5) connectedto the word lines WLs. The plurality of conductive layers 110 areelectrically independent from each other for each memory block BLK.

One or a plurality of conductive layers 110 located below theabove-described conductive layers 110 function as the drain-sideselection gate line SGD and the gate electrodes of the plurality ofdrain-side select transistors STD (FIG. 5) connected to the drain-sideselection gate line SGD. The widths of the plurality of conductivelayers 110 that function as the drain-side selection gate line SGD inthe Y direction are smaller than the widths of the other conductivelayers 110 that function as the word lines WLs. The inter-string unitinsulating layer SHE (FIG. 15) is provided between the two conductivelayers 110 that function as the drain-side selection gate line SGD andare adjacent to each other in the Y direction. The plurality ofconductive layers 110 functioning as the drain-side selection gate lineSGD are electrically independent for each string unit SU.

For example, as illustrated in FIG. 15, the semiconductor pillars 120are arranged in the X direction and the Y direction in a predeterminedpattern. The semiconductor pillars 120 function as channel regions ofthe plurality of memory cells MC and select transistors (STD and STS)included in one memory string MS (FIG. 5). The semiconductor pillar 120is a semiconductor layer made of polycrystalline silicon (Si), forexample. For example, the semiconductor pillar 120 has, for example, asubstantially cylindrical shape, and an insulating layer 125 (FIG. 10)made of silicon oxide or the like is provided at a central portion ofthe semiconductor pillar 120. An outer peripheral surface of each of thesemiconductor pillars 120 is surrounded by the conductive layer 110 andfaces the conductive layer 110.

As illustrated in FIG. 9, the semiconductor pillar 120 includes asemiconductor portion 120 _(U) provided in the memory cell array layerL_(MCA1) and a semiconductor portion 120 _(L) provided in the memorycell array layer L_(MCA2).

The semiconductor portion 120 _(U) faces a plurality of conductivelayers 110 provided in the memory cell array layer L_(MCA1). An impurityregion containing N-type impurities such as phosphorus (P) is providedat an upper end portion of the semiconductor portion 120 _(U). Such animpurity region is connected to the conductive layer 112 (FIG. 9).

The semiconductor portion 120 _(L), faces the plurality of conductivelayers 110 provided in the memory cell array layer L_(MCA2). An impurityregion containing N-type impurities such as phosphorus (P) is providedat a lower end portion of the semiconductor portion 120 _(L). Such animpurity region is connected to the bit line BL via a contact Ch and acontact Vy.

The gate insulating film 130 (FIG. 10) has a substantially cylindricalshape that covers the outer peripheral surface of the semiconductorpillar 120. For example, as illustrated in FIG. 10, the gate insulatingfilm 130 includes a tunnel insulating film 131, a charge storage film132, and a block insulating film 133, which are stacked between thesemiconductor pillar 120 and the conductive layer 110. The tunnelinsulating film 131 and the block insulating film 133 are insulatingfilms made of silicon oxide (SiO₂), for example. The charge storage film132 is a film that is made of silicon nitride (Si₃N₄) and is capable ofstoring charges, for example. The tunnel insulating film 131, the chargestorage film 132, and the block insulating film 133 have a substantiallycylindrical shape, and extend in the Z direction along the outerperipheral surface of the semiconductor pillar 120.

FIG. 10 illustrates an example in which the gate insulating film 130includes the charge storage film 132 made of silicon nitride or thelike. However, the gate insulating film 130 may include, for example, afloating gate made of polycrystalline silicon containing N-type orP-type impurities.

Structure of Memory Cell Array Layer L_(MCA2) in First Hookup RegionR_(HU1)

As illustrated in FIG. 13, contact connection small-regions r_(CC1)provided respectively corresponding to the memory blocks BLK areprovided in the first hookup region R_(HU1). A contact connectionsmall-region r_(C4T) provided corresponding to the memory block BLKf isprovided in the first hookup region R_(HU1).

As illustrated in FIG. 14, end portions of the plurality of conductivelayers 110 functioning as the drain-side selection gate line SGD, in theX direction, are provided in the contact connection small-regionr_(CC1). A plurality of contacts CC arranged in a matrix when viewedfrom the Z direction are provided in the contact connection small-regionr_(CC1). The plurality of contacts CC extend in the Z direction and areconnected to the conductive layers 110 at the upper ends of the contactsCC. The contact CC may include, for example, a laminated film of abarrier conductive film made of titanium nitride (TiN) or the like and ametal film made of tungsten (W) or the like.

Among the plurality of contacts CC arranged in the X direction, thecontact CC closest to the memory hole region R_(MH) is connected to thefirst conductive layer 110 counting from the bottom. The second contactCC closest to the memory hole region R_(MH) is connected to the secondconductive layer 110 counting from the bottom. In the followings,similarly, the a-th (a is a positive integer of 1 or more) contact CCclosest to the memory hole region R_(MH) is connected to the a-thconductive layer 110 counting from the bottom. Some of the plurality ofcontacts CC are connected to the drain electrodes of the transistors Trin the chip C_(M) or the chip C_(P) via the wiring m0 and the like inthe wiring layer M0.

Among the plurality of contacts CC, the contacts corresponding to thememory blocks BLKf (FIG. 13) are connected to contacts C4 in the contactconnection small-region r_(C4T) corresponding to the memory blocks BLKf,respectively, and are electrically connected to the transistors Trprovided on the semiconductor substrate 100 in the chip C_(M) via thecontacts C4. Among the plurality of contacts CC, the contactscorresponding to the memory blocks BLKa (FIG. 13) are connected tocontacts C4 in the contact connection small-region r_(C4T) correspondingto the memory blocks BLKf adjacent to the memory blocks BLKa,respectively, and are electrically connected to the transistors Trprovided on the semiconductor substrate 100 in the chip C_(M) via thecontacts C4.

For example, as illustrated in FIG. 14, a support structure HR providednear the contact CC is provided in the first hookup region R_(HU1). Thesupport structure HR extends in the Z direction and is connected to theconductive layer 112 at the upper end of the support structure HR. Thesupport structure HR includes an insulating layer made of silicon oxide(SiO₂) , for example.

Two insulating layers S_(TO) arranged in the Y direction are provided inthe contact connection small-region r_(C4T). The two insulating layersS_(TO) are provided between two inter-block insulating layers STarranged in the Y direction. For example, as illustrated in FIG. 9, theplurality of insulating layers 110A arranged in the Z direction and theplurality of contacts C4 extending in the Z direction are providedbetween the two insulating layers S_(TO).

The insulating layer S_(TO) (FIG. 14) extends in the X direction and theZ direction and is connected to the conductive layer 112 at the upperend of the insulating layer S_(TO). The insulating layer S_(TO)contains, for example, silicon oxide (SiO₂).

The insulating layer 110A is a substantially plate-shaped insulatinglayer extending in the X direction. The insulating layer 110A mayinclude an insulating layer made of silicon nitride (Si₃N₄) or the like.Insulating layers made of silicon oxide (SiO₂) or the like are providedbetween the plurality of insulating layers 110A arranged in the Zdirection.

The plurality of contacts C4 are arranged in the X direction. Thecontact C4 may include a laminated film of a barrier conductive filmmade of titanium nitride (TiN) or the like and a metal film made oftungsten (W) or the like. For example, as illustrated in FIG. 9, theouter peripheral surface of the contact C4 is surrounded by therespective insulating layers 110A, and is connected to the insulatinglayers 110A. For example, as illustrated in FIG. 9, the contact C4extends in the Z direction, is connected to the wiring m0 in the wiringlayer M0 at the lower end of the contact C4, and is connected to thewiring d2 in the wiring layer D2 at the upper end of the contact C4.

The plurality of conductive layers 110 functioning as the drain-sideselection gate line SGD may be connected to the transistors Tr in thechip C_(P) instead of the transistors Tr in the chip C_(M). In thiscase, the plurality of conductive layers 110 are electrically connectedto the transistors Tr provided on the semiconductor substrate 150 of thechip C_(P) via the contacts CC, the first bonding electrode P_(I1), andthe second bonding electrode P_(I2). Further, in this case, the contactconnection small-region r_(C4T) in the first hookup region R_(HU1) mayalso be omitted.

Structure of Memory Cell Array Layers L_(MCA1) and L_(MCA2) in SecondHookup region R_(HU2)

As illustrated in FIG. 12, a plurality of contact connectionsmall-regions r_(CC2) and a plurality of contact connectionsmall-regions r_(C4T) are provided in a region of the second hookupregion R_(HU2) on one side (for example, negative side in the Xdirection in FIG. 12) in the X direction. The plurality of contactconnection small-regions r_(CC2) are provided at positions correspondingto the memory blocks BLKa. The plurality of contact connectionsmall-regions r_(C4T) are provided at positions corresponding to thememory blocks BLKf.

As illustrated in FIG. 12, a plurality of contact connectionsmall-regions r_(CC2) and a plurality of contact connectionsmall-regions r_(C4T) are also provided in a region of the second hookupregion R_(HU2) on the other side (for example, positive side in the Xdirection in FIG. 12) in the X direction. The plurality of contactconnection small-regions r_(CC2) are provided at positions correspondingto the memory blocks BLKf. The plurality of contact connectionsmall-regions r_(C4T) are provided at positions corresponding to thememory blocks BLKa.

Some of the plurality of conductive layers 110 functioning as the wordline WL or the source-side selection gate line SGS are provided in thecontact connection small-region r_(CC2). A plurality of contacts CCarranged in the X direction are provided in the contact connectionsmall-region r_(CC2). For example, as illustrated in FIG. 9, theplurality of contacts CC extend in the Z direction and are connected tothe conductive layers 110 at the upper ends of the contacts CC. Thecontact CC may include, for example, a laminated film of a barrierconductive film made of titanium nitride (TiN) or the like and a metalfilm made of tungsten (W) or the like.

Among the plurality of contacts CC arranged in the X direction, thecontact CC closest to the memory hole region R_(MH) is connected to thefirst conductive layer 110 counting from the top. The second contact CCclosest to the memory hole region R_(MH) is connected to the secondconductive layer 110 counting from the top. In the followings,similarly, the b-th (b is a positive integer of 1 or more) contact CCclosest to the memory hole region R_(MH) is connected to the b-thconductive layer 110 counting from the top.

For example, as illustrated in FIGS. 8 and 12, some of the plurality ofcontacts CC are connected to the contacts C4 in the contact connectionsmall-region r_(C4T) corresponding to the memory blocks BLK adjacent tothe memory block BLK, via the wiring m0 extending in the Y direction,respectively, and are electrically connected to the transistors Trprovided on the semiconductor substrate 100 in the chip C_(M) via thecontacts C4. Some of the plurality of contacts CC are electricallyconnected to the transistors Tr provided on the semiconductor substrate150 of the chip C_(P) via the first bonding electrode P_(I1) and thesecond bonding electrode P_(I2), respectively.

Structure of Wiring Layers M0, M1, M2, and M3

As illustrated in FIG. 8, the plurality of wirings included in thewiring layers M0, M1, M2, and M3 are electrically connected to at leastone of the components in the memory cell array layers L_(MCA1) andL_(MCA2), the components in the transistor layer L_(TR), and thecomponents in the chip C_(P).

The wiring layers M0, M1, and M2 include a plurality of wirings m0, m1,and m2, respectively. The plurality of wirings m0, m1, and m2 mayinclude, for example, a laminated film of a barrier conductive film madeof titanium nitride (TiN), tantalum nitride (TaN) or the like and ametal film made of tungsten (W) , copper (Cu) , or the like. Some of theplurality of wirings m0 function as the bit lines BL (FIG. 5) . Forexample, as illustrated in FIG. 15, the bit lines BL are arranged in theX direction and extend in the Y direction. Each of the plurality of bitlines BL is connected to one semiconductor pillar 120 included in eachstring unit SU.

For example, as illustrated in FIG. 8, the wiring layer M3 includes aplurality of first bonding electrodes P_(I1). The plurality of firstbonding electrodes P_(I1) may include, for example, a laminated film ofa barrier conductive film made of titanium nitride (TiN) , tantalumnitride (TaN) or the like and a metal film made of copper (Cu), or thelike.

Structure of Chip C_(P)

FIG. 16 is a cross-sectional view schematically illustrating the chipC_(P). The chip C_(P) includes, for example, a transistor layer L_(TR)′provided on the upper surface of the semiconductor substrate 150, awiring layer M7 provided above the transistor layer L_(TR)′, a wiringlayer M6 provided above the wiring layer M7, a wiring layer M5 providedabove the wiring layer M6, and a wiring layer M4 provided above thewiring layer M5.

The semiconductor substrate 150 is a semiconductor substrate configuredwith P-type silicon (Si) containing P-type impurities such as boron (B),for example. An active region 150A and an insulating region 150I made ofsilicon oxide (SiO₂) or the like are provided on the front surface ofthe semiconductor substrate 150. The active region 150A may be an N-typewell region containing N-type impurities such as phosphorus (P), aP-type well region containing P-type impurities such as boron (B), or asemiconductor substrate region in which the N-type well region and theP-type well region are not provided.

Structure of Transistor Layer L_(TR)′

For example, as illustrated in FIG. 16, a wiring layer GC′ is providedon the upper surface of the semiconductor substrate 150 via aninsulating layer (not illustrated). The wiring layer GC′ includes aplurality of electrodes gc′ facing the front surface of thesemiconductor substrate 150. The plurality of electrodes gc′ included ineach region of the semiconductor substrate 150 and the wiring layer GC′are connected to contacts CS′, respectively.

The active regions 150A of the semiconductor substrate 150 function aschannel regions of a plurality of transistors Tr constituting theperipheral circuit PC, one electrodes of a plurality of capacitors, andthe like, respectively.

The plurality of electrodes gc′ included in the wiring layer GC′functions as gate electrodes of the plurality of transistors Trconstituting the peripheral circuit PC, the other electrodes of theplurality of capacitors, and the like, respectively.

The contact CS′ extends in the Z direction and is connected to the uppersurface of the semiconductor substrate 150 or the upper surface of theelectrode gc′ at the lower end of the contact CS′. An impurity regioncontaining N-type impurities or P-type impurities is provided at aportion at which the contact CS′ and the semiconductor substrate 150 areconnected to each other. The contact CS′ may include, for example, alaminated film of a barrier conductive film made of titanium nitride(TiN) or the like and a metal film made of tungsten (W) or the like.

Structure of Wiring Layers M7, M6, and M5

A plurality of wirings included in the wiring layers M7, M6, and M5 areelectrically connected to at least one of the components in thetransistor layer L_(TR)′ and the semiconductor substrate 150.

The wiring layers M7, M6, and M5 include a plurality of wirings m7, m6,and m5, respectively. The plurality of wirings m7, m6, and m5 mayinclude, for example, a laminated film of a barrier conductive film madeof titanium nitride (TiN), tantalum nitride (TaN) or the like and ametal film made of tungsten (W), copper (Cu), aluminum (Al), or thelike.

The wiring layer M4 includes a plurality of second bonding electrodesP_(I2). The plurality of second bonding electrodes P_(I2) may include,for example, a laminated film of a barrier conductive film made oftitanium nitride (TiN), tantalum nitride (TaN) or the like and a metalfilm made of copper (Cu), or the like.

Arrangement of Transistors Tr Constituting Peripheral Circuit PC

Next, the arrangement of the transistors Tr constituting the peripheralcircuit PC will be described with reference to FIGS. 17 to 22. FIG. 17is a cross-sectional view schematically illustrating the configurationof the memory die MD. FIG. 18 is a bottom view schematicallyillustrating the configuration of the memory cell array layers L_(MCA1)and L_(MCA2) in the chip C_(M). FIG. 19 is a bottom view schematicallyillustrating the configuration of the transistor layer L_(TR) in thechip C_(M). FIG. 20 is a plan view schematically illustrating theconfiguration of the chip C_(P). FIG. 21 is a bottom view schematicallyillustrating the transistor layer L_(TR) in the chip C_(M). FIG. 22 is aplan view schematically illustrating a partial configuration of the chipC_(P). FIGS. 21 and 22 illustrate the components provided at positionsoverlapping the components in FIG. 12 when viewed from the Z direction.

FIG. 18 illustrates a region R_(BLT) in the memory cell array regionR_(MCA), which is not described with reference to FIG. 11. For example,components for connecting the bit lines BL (FIG. 9) and the transistorsTr in the chip C_(P) to each other are provided in the region R_(BLT).In FIGS. 17 to 22, the illustration of the first hookup region R_(HU1)is omitted similar to FIG. 12.

Arrangement of Transistors Tr in Chip C_(M)

As described above, the plurality of transistors Tr are provided in thetransistor layer L_(TR) of the chip C_(M). As illustrated in FIGS. 18and 19, among the plurality of transistors Tr, the transistor Trprovided in the second hookup region R_(Hu2) functions as a portion(transistor T_(BLK)) of the block decoder BLKD described with referenceto FIG. 6. For example, the capacitors Cap (FIG. 17) may be provided inother regions instead of the transistors Tr. For example, as illustratedin FIG. 9, the capacitor Cap may include an active region 100A, anelectrode gc, and a gate insulating film provided between the activeregion 100A and the electrode gc, similar to the transistor Tr. The filmthickness (thickness in the Z direction) of the electrode gc and thegate insulating film constituting the capacitor Cap may be substantiallyequal to the film thickness (thickness in the Z direction) of theelectrode gc and the gate insulating film constituting the transistorTr. The capacitor Cap maybe connected between the bonding pad electrodeP_(X) to which the power-source voltage V_(CC) or V_(CCQ) is supplied,and the bonding pad electrode P_(X) to which the ground voltage V_(SS)is supplied.

In the example of FIG. 21, a plurality of transistor rows arranged inthe Y direction are provided in the second hookup region R_(HU2) tocorrespond to the plurality of memory blocks BLK arranged in the Ydirection. Each transistor row includes a plurality of transistors Trarranged in the X direction.

In the example of FIG. 21, a plurality of transistors Tr are provided atpositions corresponding to the contact connection small-regions r_(CC2)(see FIG. 12) including the contacts CC connected to the memory blocksBLK_(A). A plurality of transistors Tr are provided at positions whichcorrespond to BLK_(B) and correspond to the contact connectionsmall-regions r_(C4T) (see FIG. 12) including the contacts C4 connectedto the memory block BLK_(A). Each of the drain electrodes of theplurality of transistors Tr is electrically connected to the word lineWL or the like in the memory block BLK_(A) via the contact C4. Each ofthe drain electrodes of the plurality of transistors Tr are electricallyconnected to any of the wirings m7, m6, and m5 functioning as the wiringCG (FIG. 6) via the contacts C4 in the second hookup region R_(HU2), thewirings m0, m1, and m2, the first bonding electrode P_(I1), and thesecond bonding electrode P_(I2).

Similarly, in the example of FIG. 21, a plurality of transistors Tr areprovided at positions corresponding to the contact connectionsmall-regions r_(CC2) including the contacts CC connected to any memoryblock BLK. A plurality of transistors Tr are provided at positions whichcorrespond to a memory block BLK adjacent to the above memory block BLKand correspond to the contact connection small-regions r_(C4T) includingthe contacts C4 connected to the above memory block BLK. Each of thedrain electrodes of the plurality of transistors Tr is electricallyconnected to the word line WL or the like in the corresponding memoryblock BLK via the contact C4. Each of the drain electrodes of theplurality of transistors Tr are electrically connected to any of thewirings m7, m6, and m5 functioning as the wiring CG (FIG. 6) via thecontacts C4 in the second hookup region R_(HU2,) the wirings m0, m1, andm2, the first bonding electrode P_(I1), and the second bonding electrodeP_(I2).

In the example of FIG. 21, the width of the active region 100Acorresponding to the transistor T_(BLK) is set as a width X_(TAM), andthe length of the active region 100A corresponding to the transistorT_(BLK) in the Y direction is set as Y_(TAM). In the example of FIG. 21,the distance between two adjacent active regions 100A in the X directionis set as a distance X_(TIM), and the distance between the two adjacentactive regions 100A in the Y direction is set as a distance Y_(TIM).

Arrangement of Transistors Tr in Chip C_(P)

As described above, the plurality of transistors Tr are provided on thefront surface of the semiconductor substrate 150 of the chip C_(P). Asillustrated in FIGS. 18 and 20, among the plurality of transistors Tr,the transistor Tr provided in the second hookup region R_(HU2) functionsas a portion (transistor T_(BLK)) of the block decoder BLKD describedwith reference to FIG. 6. The transistor provided in the memory holeregion R_(MH) functions as a portion of the sense amplifier module SAMor the cache memory CM (FIG. 4).

In the example of FIG. 22, a plurality of transistor rows arranged inthe Y direction are provided in the second hookup region R_(HU2) tocorrespond to the plurality of memory blocks BLK arranged in the Ydirection. Each transistor row includes a plurality of transistors Trarranged in the X direction.

In the example of FIG. 22, a plurality of transistors Tr are provided atpositions corresponding to the contact connection small-regions r_(CC2)(see FIG. 12) including the contacts CC connected to the memory blocksBLKA. A plurality of transistors Tr are provided at positions whichcorrespond to BLK_(B) and correspond to the contact connectionsmall-regions r_(C4T) (see FIG. 12) including the contacts C4 connectedto the memory block BLK_(A). Each of the plurality of transistors Tr iselectrically connected to the word line WL or the like in the memoryblock BLK_(A) via the first bonding electrode P_(I1) and the secondbonding electrode P_(I2).

Similarly, in the example of FIG. 22, a plurality of transistors Tr areprovided at positions corresponding to the contact connectionsmall-regions r_(CC2) including the contacts CC connected to any memoryblock BLK. A plurality of transistors Tr are provided at positions whichcorrespond to a memory block BLK adjacent to the above memory block BLKand correspond to the contact connection small-regions r_(C4T) includingthe contacts C4 connected to the above memory block BLK. Each of theplurality of transistors Tr is electrically connected to the word lineWL or the like in the corresponding memory block BLK via the firstbonding electrode P_(I1) and the second bonding electrode P_(I2).

In the example of FIG. 22, the width of the active region 150Acorresponding to the transistor T_(BLK), in the X direction, is set asX_(TAP), and the length of the active region 150A corresponding to thetransistor T_(BLK), in the Y direction, is set as Y_(TAP). In theexample of FIG. 22, the distance between two adjacent active regions100A in the X direction is set as a distance X_(TIP), and the distancebetween the two adjacent active regions 100A in the Y direction is setas a distance Y_(TIP).

In the examples of FIGS. 21 and 22, the width X_(TAP) is smaller thanthe width X_(TAM). The distance X_(TIP) is smaller than the distanceX_(TIM). The length Y_(TAP) is equal to the length Y_(TAM). The distanceY_(TIP) is equal to the distance Y_(TIM). For example, the width of theentire region in which the transistors T_(BLK) are provided on the frontsurface of the semiconductor substrate 100, in the X direction, maybelarger than the width of the entire region in which the transistorsT_(BLK) are provided on the front surface of the semiconductor substrate150, in the X direction. In such a case, for example, all thetransistors T_(BLK) included in the chip C_(P) may be provided withinthe range of the second hookup region R_(HU2), and the transistorsT_(BLK) included in the chip C_(P) may be provided over the secondhookup region R_(HU2), and the first hookup region R_(HU1), and aportion of the memory hole region R_(MH).

Effect of First Embodiment

As described above, the plurality of conductive layers 110 areelectrically connected to the plurality of transistors T_(BLK). Thetransistor T_(BLK) is provided corresponding to the conductive layer110. That is, the number of transistors T_(BLK) is equal to the numberof conductive layers 110. Here, when the semiconductor storage device ishighly integrated in the Z direction, the number of conductive layers110 stacked in the Z direction increases. In this case, the number oftransistors T_(BLK) also increases corresponding to the number ofconductive layers 110. Here, considering the wiring layout connected tothe circuit of the transistor T_(BLK), it is preferable that the circuitof the transistor T_(BLK) extends from the second hookup region R_(HU2)in the X direction and is arranged, which contributes to the reductionof the wiring area. However, in a case where the circuit area of thetransistor T_(BLK) becomes large in the X direction, there is a concernthat high density integration of the semiconductor storage device in theX direction has a difficulty, and high density integration is hindered.

Thus, in the first embodiment, both the transistor Tr in the chip C_(P)and the transistor Tr in the chip C_(M) are used as the transistorT_(BLK). According to such a configuration, it is possible to implementa semiconductor storage device that facilitates high density integrationin the X direction by appropriately dividing and arranging the circuitof the transistor T_(BLK) in the Z direction.

For the reason in the manufacturing process, the transistor Tr in thechip C_(M) may have an operating speed slower than the transistor Tr inthe chip C_(P). Here, the transistor T_(BLK) has a need for a high-speedoperation, which is lower than the input/output control circuit I/O(FIG. 4), for example. Thus, when the transistor Tr is used as thetransistor T_(BLK), it is considered that, even though the transistor Trin the chip C_(M) and the transistor Tr in the chip C_(P) are usedtogether, the influence on the operating speed of the semiconductorstorage device is small. Thus, in the first embodiment, it is possibleto achieve high density integration of a semiconductor storage devicewhile suppressing the influence on the operating speed.

For the reason in the manufacturing process, the transistor Tr in thechip C_(M) may have a more difficulty in high density integration thanthe transistor Tr in the chip C_(P). Therefore, in the first embodiment,the width X_(TAM) (FIG. 21) of the active region 100A constituting thetransistor T_(BLK) in the chip C_(M), in the X direction, is set to belarger than the width X_(TAP) (FIG. 22) of the active region 150Aconstituting the transistor T_(BLK) in the chip C_(P), in the Xdirection. As a result, in the first embodiment, it is possible toachieve high density integration of a semiconductor storage device whilesuppressing a decrease in yield.

Second Embodiment

Next, a semiconductor storage device according to a second embodimentwill be described with reference to FIG. 23. FIG. 23 is across-sectional view schematically illustrating a semiconductor storagedevice according to the second embodiment.

For example, as illustrated in FIG. 17 and the like, the memory die MDaccording to the first embodiment includes the chip C_(M) including thememory cell array MCA and the chip C_(P) bonded to the chip C_(M). Theperipheral circuit PC is mainly configured with the transistors Trincluded in the chip C_(P), and the transistors Tr included in thememory cell array MCA are used only as some of the plurality oftransistors T_(BLK). On the other hand, for example, as illustrated inFIG. 23, a memory die MD2 according to the second embodiment includes achip C_(M2) including a memory cell array MCA and a chip C_(P2) bondedto the chip C_(M2).

The chip C_(M2) is basically configured in a manner similar to the chipC_(M). However, the chip C_(M2) includes a semiconductor substrate 200instead of the semiconductor substrate 100. The semiconductor substrate200 is basically configured in a manner similar to the semiconductorsubstrate 100. However, among a plurality of transistors Tr provided onthe front surface of the semiconductor substrate 200, the transistorsprovided in a memory hole region R_(MH) function as a portion of thesense amplifier module SAM or the cache memory CM (FIG. 4).

The chip C_(P2) is basically configured in a manner similar to the chipC. However, the chip C_(P2) includes a semiconductor substrate 250instead of the semiconductor substrate 150. The semiconductor substrate250 is basically configured in a manner similar to the semiconductorsubstrate 150. However, the above-described capacitor Cap is provided ina region other than the second hookup region R_(HU2) on the surface ofthe semiconductor substrate 250 of the chip C_(P2). cl Third Embodiment

Next, a semiconductor storage device according to a third embodimentwill be described with reference to FIG. 24. FIG. 24 is across-sectional view schematically illustrating a semiconductor storagedevice according to the third embodiment.

For example, as illustrated in FIG. 17 and the like, the memory die MDaccording to the first embodiment includes the chip C_(M) including thememory cell array MCA, and the transistors Tr are provided in the chipC_(M). Similarly, as described with reference to FIG. 23, for example,the memory die MD2 according to the second embodiment includes the chipC_(M2) including the memory cell array MCA, and the transistors Tr areprovided in the chip C_(M2). On the other hand, for example, asillustrated in FIG. 24, a memory die MD3 according to the thirdembodiment includes a chip C_(M3) including a memory cell array MCA, achip C_(P2)bonded to the front surface (lower surface) of the chipC_(M3), and a chip C_(P3) bonded to the rear surface (upper surface) ofthe chip C_(M3).

The chip C_(M3) is basically configured in a manner similar to the chipC_(M). However, the chip C_(M3) does not include the semiconductorsubstrate 100 and the transistor layer L_(TR). A plurality of thirdbonding electrodes P_(I3) are provided on the rear surface (uppersurface) of the chip C_(M3). The plurality of third bonding electrodesP_(I3) are basically configured in a manner similar to the plurality offirst bonding electrodes P_(I1).

The chip C_(P3) is basically configured in a manner similar to the chipC_(P). However, a plurality of fourth bonding electrodes PI4 areprovided on the front surface (lower surface) of the chip C_(P3) insteadof the plurality of second bonding electrodes P_(I2). The plurality offourth bonding electrodes PI4 are basically configured in a mannersimilar to the plurality of second bonding electrodes P_(I2). However,the plurality of fourth bonding electrodes PI4 are connected not to theplurality of first bonding electrodes P_(I1), but to the plurality ofthird bonding electrodes P_(I3). Although not illustrated, a bonding padelectrode P_(X) is provided on the rear surface (upper surface) of thechip C_(P3).

Fourth Embodiment

Next, a semiconductor storage device according to a fourth embodimentwill be described with reference to FIG. 25. FIG. 25 is across-sectional view schematically illustrating a semiconductor storagedevice according to the fourth embodiment.

For example, as illustrated in FIG. 17 and the like, the memory die MDaccording to the first embodiment includes the chip C_(M) and the chipC_(P). The chip C_(M) includes the memory cell array layers L_(MCA1) andL_(MCA2), and the transistor layer L_(TR). The transistor layer L_(TR)is spaced from the memory cell array layers L_(MCA1) and L_(MCA2) in theZ direction. On the other hand, for example, as illustrated in FIG. 25,a memory die MD4 according to the fourth embodiment includes a chipC_(M4) including a memory cell array MCA and a chip C_(P4) bonded to thechip C_(M4).

The chip C_(M4) is basically configured in a manner similar to the chipC_(M). However, the chip C_(M4) includes a semiconductor substrate 400instead of the semiconductor substrate 100. The chip C_(M4) does notinclude the transistor layer L_(TR). The semiconductor substrate 400 isbasically configured in a manner similar to the semiconductor substrate100. However, a memory cell array region R_(MCA)′ is provided in thesemiconductor substrate 400 instead of the memory cell array regionR_(MCA). The memory cell array region R_(MCA)′ has a memory hole regionR_(MH)′ and two hookup regions R_(HU)′ adjacent to the memory holeregion R_(MH)′. A transistor region RTR is provided at a positionadjacent to the memory cell array region R_(MCA)′ in the X direction.

The configuration of the memory hole region R_(MH)′ of the memory cellarray layers L_(MCA1) and L_(MCA2) is basically similar to theconfiguration of the memory hole region R_(MH) of the memory cell arraylayers L_(MCA1) and L_(MCA2) in the chip C_(M). However, a conductivelayer 112 is not provided in the memory hole region R_(MH)′. The upperend of the semiconductor pillar 120 in the memory hole region R_(MH) isconnected not to the conductive layer 112 but to the semiconductorsubstrate 400.

The hookup region R_(HU)′ is basically configured in a manner similar tothe first hookup region R_(HU1) and the second hookup region R_(HU2).However, a contact connection small-region r_(C4T) is not provided inthe hookup region R_(HU)′.

In the transistor region R_(TR), a plurality of transistors Tr areprovided on the front surface (lower surface) of the semiconductorsubstrate 400. The plurality of transistors Tr constitute a portion ofthe block decoder BLKD. The plurality of transistors Tr are connected tothe components in the memory cell array layer L_(MCA1) via contacts CCor the like.

The chip C_(P4) is basically configured in a manner similar to the chipC_(P). However, the chip C_(P4) includes a semiconductor substrate 450instead of the semiconductor substrate 150. The semiconductor substrate450 is basically configured in a manner similar to the semiconductorsubstrate 150. However, among the plurality of transistors Tr providedon the front surface (upper surface) of the semiconductor substrate 450,the transistors Tr provided in the hookup region R_(HU)′ and thetransistor region RTR constitute a portion of the block decoder BLKD.The plurality of transistors Tr are connected to the components in thememory cell array layers L_(MCA1) and L_(MCA2) via the contacts CC, thefirst bonding electrode P_(I1), the second bonding electrode P_(I2), andthe like.

Other Embodiments

Hitherto, the semiconductor storage device according to the first tofourth embodiments has been described. However, the semiconductorstorage device to the above embodiments are merely examples, andspecific configurations, operations, and the like can be appropriatelyadjusted.

For example, as illustrated in FIGS. 17, 23, and 24, in thesemiconductor storage device according to the first to thirdembodiments, the two memory hole regions R_(MH) arranged in the Xdirection are provided in the memory cell array region R_(MCA), and thesecond hookup region R_(HU2) is provided between the two memory holeregions R_(MH). On the other hand, for example, a chip C_(M)′ and a chipC_(P)′ illustrated in FIG. 26 are basically configured in a mannersimilar to the chip C_(M) and the chip C_(P) according to the firstembodiment. However, in the chip C_(M)′, two second hookup regionsR_(HU2) arranged in the X direction are provided in a memory cell arrayregion R_(MCA), and a memory hole region R_(MH) is provided between thetwo second hookup regions R_(HU2). Among a plurality of transistors Trprovided on the front surfaces of the chip C_(M)′ and the chip C_(P)′,the transistors Tr provided in the second hookup region R_(HU2) functionas a portion of the block decoder BLKD.

Such a configuration can also be applied to the semiconductor storagedevice according to the second or third embodiment.

For example, as illustrated in FIG. 24, in the semiconductor storagedevice according to the third embodiment, the chip C_(M3) does notinclude the semiconductor substrate. The plurality of third bondingelectrodes P_(I3) are provided on the rear surface (upper surface) ofthe chip C_(M3). On the other hand, for example, a chip C_(M3)′illustrated in FIG. 27 includes a semiconductor substrate 500. The chipC_(M3)′ includes a plurality of through-electrode TSVs penetrating thesemiconductor substrate 500 and electrodes E provided at the upper endsof the plurality of through-electrodes TSV. In such a configuration,some conductive layers 110 in the memory cell array layers L_(MCA1) andL_(MCA2) are connected to the transistors Tr included in the blockdecoder BLKD in the chip C_(P3) via the contacts CC, the contacts C4,the third bonding electrodes P_(I3), the through-electrodes TSV, theelectrodes E, and the fourth bonding electrodes PI4.

In the above example, among a plurality of conductive layers 110provided in the memory cell array layers L_(MCA1) and L_(MCA2), theconductive layer 110 connected to the transistor Tr in the chip C_(M),C_(M2), C_(M4), or C_(M)′ (referred to as the “chip C_(M) or the like”below) and the conductive layer 110 connected to the transistor Tr inthe chip C_(P), C_(P2), C_(P3), C_(P4), or C_(P)′ (referred to as the“chip C_(P) or the like” below) can be appropriate adjusted.

For example, a plurality of conductive layers 110 included in one of thememory cell array layers L_(MCA1) and L_(MCA2) are connected to thetransistors Tr in the chip C_(M) or the like, and a plurality ofconductive layers 110 included in the other memory cell array layer maybe connected to the transistors Tr in the chip C_(P) or the like.

For example, the number of conductive layers 110 connected to thetransistors Tr in the chip C_(P) or the like may be greater than thenumber of conductive layers 110 connected to the transistors Tr in thechip C_(M) or the like. As described above, for the reason in themanufacturing process, the transistor Tr in the chip C_(M) may have amore difficulty in high density integration than the transistor Tr inthe chip C_(P). Thus, it is possible to reduce the circuit area bysetting the number of conductive layers 110 connected to the transistorsTr in the chip C_(P) or the like to be greater than the number ofconductive layers 110 connected to the transistors Tr in the chip C_(M)or the like.

Further, for example, the even-numbered or odd-numbered conductivelayers 110 counting from the top may be connected to the transistors Trin the chip C_(P) or the like, and the odd-numbered or even-numberedconductive layers 110 counting from the top maybe connected to thetransistors Tr in the chip C_(M) or the like. For example, theconductive layers 110 included in the even-numbered or odd-numberedmemory blocks BLK counting from one side (for example, negative side inthe Y direction. see FIG. 12) in the Y direction may be connected to thetransistors Tr in the chip C_(P) or the like, and the conductive layers110 included in the odd-numbered or even-numbered memory blocks BLKcounting from the one side in the Y direction may be connected to thetransistors Tr in the chip C_(M) or the like. For example, theconductive layers 110 included in one of the memory blocks BLKa and BLKfdescribed with reference to FIG. 12 and the like may be connected to thetransistors Tr in the chip C_(P) or the like, and the conductive layers110 included in the other of the memory blocks BLKa and BLKf may beconnected to the transistors Tr in the chip C_(M) or the like.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the disclosure. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein maybe made without departing from the spirit of thedisclosure. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the disclosure.

What is claimed is:
 1. A semiconductor storage device comprising: afirst semiconductor substrate; a second semiconductor substrate; a firstmemory cell and a second memory cell provided between the firstsemiconductor substrate and the second semiconductor substrate; a firstword line electrically connected to the first memory cell; a second wordline electrically connected to the second memory cell; a firsttransistor that is provided on the first semiconductor substrate andelectrically connected between the first word line and a first wiringthrough which a voltage is applied to the first word line; and a secondtransistor that is provided on the second semiconductor substrate andelectrically connected between the second word line and a second wiringthrough which a voltage is applied to the second word line.
 2. Thesemiconductor storage device according to claim 1, further comprising: afirst chip including the first semiconductor substrate, the first memorycell and the second memory cell, the first word line, the second wordline, the first transistor, and a first bonding electrode electricallyconnected to the second word line; and a second chip including thesecond semiconductor substrate, the second transistor, and a secondbonding electrode electrically connected to the second transistor,wherein the second chip is bonded to the first chip via the firstbonding electrode and the second bonding electrode.
 3. The semiconductorstorage device according to claim 2, wherein the first semiconductorsubstrate includes a first active region for the first transistor, andthe second semiconductor substrate includes a second active region forthe second transistor, and a width of the first active region in a firstdirection, along which the first and second word lines extend, isgreater than a width of the second active region in the first direction.4. The semiconductor storage device according to claim 3, furthercomprising: a bit line; and a sense amplifier module including aplurality of transistors including a sense transistor having a gateelectrically connected to the bit line, wherein a plurality of thirdtransistors are provided on the first semiconductor substrate and atleast one of the third transistors are transistors of the senseamplifier module.
 5. The semiconductor storage device according to claim3, further comprising: a bit line; and a sense amplifier moduleincluding a plurality of transistors including a sense transistor havinga gate electrically connected to the bit line, wherein a plurality ofthird transistors are provided on the first semiconductor substrate andnone of the third transistors are transistors of the sense amplifiermodule.
 6. The semiconductor storage device according to claim 1,further comprising: a first chip including the first memory cell and thesecond memory cell, the first word line, the second word line, a firstbonding electrode electrically connected to the first word line, and asecond bonding electrode electrically connected to the second word line;a second chip including the first semiconductor substrate, the firsttransistor, and a third bonding electrode electrically connected to thefirst transistor; and a third chip including the second semiconductorsubstrate, the second transistor, and a fourth bonding electrodeelectrically connected to the second transistor, wherein the second chipis bonded to the first chip via the first bonding electrode and thethird bonding electrode, and the third chip is bonded to the first chipvia the second bonding electrode and the fourth bonding electrode. 7.The semiconductor storage device according to claim 1, furthercomprising: a first contact extending in a second direction intersectinga surface of the first semiconductor substrate and electricallyconnected between the first word line and the first transistor, whereinthe first word line and the second word line are spaced apart in thesecond direction, and a first end of the first contact is closer to thefirst semiconductor substrate in the second direction than the firstword line and the second word line, and a second end of the firstcontact is closer to the second semiconductor substrate in the seconddirection than the first word line and the second word line.
 8. Thesemiconductor storage device according to claim 7, further comprising: amemory cell array that includes the first and second memory cells; and asecond contact in direct contact with the first word line, extending inthe second direction, and electrically connected to the second end ofthe first contact through a wiring that is between the memory cell arrayand the second semiconductor substrate in the second direction.
 9. Thesemiconductor storage device according to claim 1, further comprising: afirst chip including the first semiconductor substrate, a memory cellarray including the first memory cell and the second memory cell, thefirst word line and the second word line, the first transistor and acapacitor formed on the first semiconductor substrate, a first padelectrode electrically connected to a first end of the capacitor and towhich a power supply voltage is to be applied, and a second padelectrode electrically connected to a second end of the capacitor and towhich a ground voltage is to be applied.
 10. The semiconductor storagedevice according to claim 1, further comprising: a first chip includingthe first semiconductor substrate, a memory cell array including thefirst memory cell and the second memory cell, a plurality of word linesincluding the first and second word lines, the first transistor, and ahookup region into which the plurality of word lines extend, whereineach word line that is closer to the first semiconductor substrate thana neighboring word line adjacent thereto extends further into the hookupregion than the neighboring word line so that a stair-shaped pattern isformed by the word lines extending into the hookup region.
 11. Asemiconductor storage device comprising: a first chip including a firstsemiconductor substrate, a memory cell array including a plurality ofmemory cells, a plurality of first and second word lines electricallyconnected to the memory cells, and a transistor region formed on thefirst semiconductor substrate, the transistor region including aplurality of first transistors that are turned on and off to controlvoltages applied to the first word lines; and a second chip bonded tothe first chip and including a second semiconductor substrate, and atransistor region including a plurality of second transistors that areturned on and off to control voltages applied to the second word lines.12. The semiconductor storage device according to claim 11, wherein adensity of the second transistors in the transistor region of the secondchip is greater than a density of the first transistors in thetransistor region of the first chip.
 13. The semiconductor storagedevice according to claim 12, wherein the first chip further includes ahookup region into which each of the plurality of first and second wordlines extends in a first direction that is parallel to a surface of thefirst semiconductor substrate, wherein each of the first and second wordlines that is closer to the first semiconductor substrate than aneighboring word line adjacent thereto extends further into the hookupregion than the neighboring word line so that a stair-shaped pattern isformed by the first and second word lines extending into the hookupregion.
 14. The semiconductor storage device according to claim 13,wherein the first transistors each have a first active region of a firstsize and the second transistors each have a second active region of asecond size, and a width of the first active region in the firstdirection is greater than a width of the second active region in thefirst direction.
 15. The semiconductor storage device according to claim14, wherein a distance in the first direction between two firsttransistors that are closest to each other in the first direction isgreater than a distance in the first direction between two secondtransistors that are closest to each other in the first direction.
 16. Asemiconductor storage device comprising: a first chip including a firstsemiconductor substrate, a memory cell array including a plurality ofmemory cells including a first memory cell and a second memory cell, aplurality of word lines electrically connected to the memory cells, aplurality of first bonding electrodes, and a transistor region formed onthe first semiconductor substrate, the transistor region including aplurality of first transistors; and a second chip including a secondsemiconductor substrate, a transistor region including a plurality ofsecond transistors, and a plurality of second bonding electrodes thatare bonded respectively to the plurality of first bonding electrodes,wherein during an operation performed on the first memory cell, one ofthe first transistors is controlled to supply a desired voltage to oneof the word lines electrically connected to the first memory cell, andduring an operation performed on the second memory cell, one of thesecond transistors is controlled to supply a desired voltage to one ofthe word lines electrically connected to the second memory cell.
 17. Thesemiconductor storage device according to claim 16, further comprising:a bit line; and a sense amplifier module including a plurality oftransistors including a sense transistor having a gate electricallyconnected to the bit line, wherein wherein at least one of the firsttransistors are transistors of the sense amplifier module.
 18. Thesemiconductor storage device according to claim 16, further comprising:a bit line; and a sense amplifier module including a plurality oftransistors including a sense transistor having a gate electricallyconnected to the bit line, wherein wherein none of the first transistorsare transistors of the sense amplifier module.
 19. The semiconductorstorage device according to claim 16, wherein the first chip furtherincludes a capacitor in the transistor region, a first pad electrodeelectrically connected to a first end of the capacitor and to which apower supply voltage is to be applied, and a second pad electrodeelectrically connected to a second end of the capacitor and to which aground voltage is to be applied.
 20. The semiconductor storage deviceaccording to claim 16, wherein a density of the second transistors inthe transistor region of the second chip is greater than a density ofthe first transistors in the transistor region of the first chip.